Our Services include

Surface Mount, Thru-hole, and Mixed technology
Low to Medium-Volume/High Mix
Large form factor boards and backplanes
SMT placement down to 0201 package size
New Product Introduction
BGA, Micro BGA and QFN placement and rework
Repair work on defective assemblies
Electromechanical
Prototype for quick turns
Box Build
BoM (Build of Material)